By DYNATEX
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StripAid™ X Solvent
StripAid™ X Solvent of dynatex is a biodegradable hydrocarbon used for debonding the temporary adhesive WaferGrip.…
Product Type:
Parts & Consumables
Application:
Bonding
Product Description:
WaferGrip™ Adhesives are advanced composite film adhesives engineered to bond wafers, thin film heads, optics and other substrates during dicing, grinding, lapping and polishing.
WaferGrip™ Adhesives consist of Ethylene Vinyl Acetate (EVA) polymers. WaferGrip™ is heat activated to bond two surfaces together. A typical application is the bonding of wafers to mounting substrates for the thinning process. WaferGrip™ preformed shapes are manufactured to suit the required application. An accurately controlled bond line provides an efficient and robust process. WaferGrip™ preformed shapes are available in three formulations: Standard, Conductive and High Temp.
WaferGrip Adhesives are available in three configurations:
- WaferGrip™ on Release Paper, used for many standard applications including wafer dicing and wafer thinning.
- WaferGrip™ on Protective Overlay, used as a temporary substrate that allows the user to cut through the wafer into the substrate below.
- WaferGrip™ on Double Sided Protective Overlay.
Process Method:
- WaferGrip™ Adhesives are removed from the release paper then applied at room temperature to a mounting substrate such as sapphire or glass.
- The part or wafer is placed over the WaferGrip.
- The entire assembly is then heated to around 110°C – 230°F for 30 to 60 seconds with light pressure, using a vacuum chamber for void free bonding.
- To remove WaferGrip™, use our specially formulated solvent StripAid X Solvent.
WaferGrip™ Adhesives are resistant to:
- Water
- IPA
- Acetone
- KOH etch solutions
- Photoresist strippers
Use our specially formulated StripAid X Solvent from dynatex to remove WaferGrip™.
| WaferGrip Temporary Adhesive Properties | Test Method | Standard WaferGrip | Conductive WaferGrip | High Temp WaferGrip |
| Softening Point (°C/°F) | ASTM-D-36 | 98/208 | 98/208 | 115/239 |
| Recommended Bond Temperature (°C/°F) | N/A | 100-120 / 212-248 | 100-120 / 212-248 | 120-140 / 212-284 |
| Lap Shear Strength (psi) (Al to Al) | ASTM-D-1002 | 400 | 395 | 490 |
| Ultimate Strength (psi/KPa) | ASTM-D-3574-E | 120/827 | 714/4922 | 517/3565 |
| C.T.E -70°C to 49°C (μm/°C) | ASTM-E-831 | 133.3 | 140.0 | 147.9 |
| Volume Resistivity (ohms-cm) | ASTM-D257 | 1.6E+14 | 8.8E+13 | 1.6E+14 |
| % Volatiles | EPA Method 16 | Negligible | Negligible | Negligible |
| Color | N/A | Blue | Purple | Green |
WaferGrip™ is available in the following thickness ranges:
- 0.8 +/- 0.15 mil – 20 μm +/- 4 μm
- 1.35 +/- 0.15 mil – 34 μm +/- 4 μm
- 2.00 +/- 0.20 mil – 50 μm +/- 5 μm
Store under cool, dry conditions away from direct sunlight. Proper storage temperatures range from –5°C/23°F to 24°C/75°F. For best results, keep unopened WaferGrip in the original sealed bag with desiccant. Shelf life at 25°C/ 77°F and 45% humidity is approximately 1.5 years.
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