WaferGrip™ Adhesives

Product Enquiry

Product Enquiry Form

    opens our Privacy Policy
  • This field is for validation purposes and should be left unchanged.

By MILLICE

Supplier Info


You may be interested in these products:

StripAid™ X Solvent

StripAid™ X Solvent is a biodegradable hydrocarbon used for debonding the temporary adhesive WaferGrip. The non-hazardous…

DXB 880 Series Wafer Bonder

The DXB 880 features an onboard process controller that automates the entire wafer bonding process. Key…

DXB 120 Series Wafer Bonder

The DXB 120 is used for process development and small-scale production. With its larger heated vacuum…

Product Type:

Parts & Consumables


Application:

Dicing, Grinding


Product Description:

WaferGrip™ Adhesives are advanced composite film adhesives engineered to bond wafers, thin film heads, optics, and other substrates during dicing, grinding, lapping, and polishing.

WaferGrip™ Adhesives consist of Ethylene Vinyl Acetate (EVA) polymers. WaferGrip™ is heat-activated to bond two surfaces together. A typical application is the bonding of wafers to mounting substrates for the thinning process. WaferGrip™ preformed shapes are manufactured to suit the required application. An accurately controlled bond line provides an efficient and robust process. WaferGrip™ preformed shapes are available in three formulations: Standard, Conductive, and High Temp.

WaferGrip Adhesives are available in three configurations:

  • WaferGrip™ on Release Paper is used for many standard applications including wafer dicing and wafer thinning.
  • WaferGrip™ on Protective Overlay is used as a temporary substrate that allows the user to cut through the wafer into the substrate below.
  • WaferGrip™ on Double-Sided Protective Overlay.

Process Method:

  1. WaferGrip™ Adhesives are removed from the release paper and then applied at room temperature to a mounting substrate such as sapphire or glass.
  2. The part or wafer is placed over the WaferGrip.
  3. The entire assembly is then heated to around 110°C / 230°F for 30 to 60 seconds with light pressure, using a vacuum chamber for void-free bonding.
  4. To remove WaferGrip™, use our specially formulated solvent StripAid X Solvent.

WaferGrip™ Adhesives are resistant to:

  • Water
  • IPA
  • Acetone
  • KOH etch solutions
  • Photoresist strippers

Use our specially formulated StripAid X Solvent to remove WaferGrip™.


WaferGrip Temporary Adhesive Properties Test Method Standard WaferGrip Conductive WaferGrip High Temp WaferGrip
Softening Point (°C/°F) ASTM-D-36 98/208 98/208 115/239
Recommended Bond Temperature (°C/°F) N/A 100-120 / 212-248 100-120 / 212-248 120-140 / 212-284
Lap Shear Strength (psi) (Al to Al) ASTM-D-1002 400 395 490
Ultimate Strength (psi/KPa) ASTM-D-3574-E 120/827 714/4922 517/3565
C.T.E -70°C to 49°C (μm/°C) ASTM-E-831 133.3 140.0 147.9
Volume Resistivity (ohms-cm) ASTM-D257 1.6E+14 8.8E+13 1.6E+14
% Volatiles EPA Method 16 Negligible Negligible Negligible
Color N/A Blue Purple Green

WaferGrip™ is available in the following thickness ranges:

  • 0.8 ± 0.15 mil / 20 μm ± 4 μm
  • 1.35 ± 0.15 mil / 34 μm ± 4 μm
  • 2.00 ± 0.20 mil / 50 μm ± 5 μm

Store under cool, dry conditions away from direct sunlight. Proper storage temperatures range from –5°C/23°F to 24°C/75°F. For best results, keep the unopened WaferGrip in the original sealed bag with desiccant. Shelf life at 25°C/ 77°F and 45% humidity is approximately 1.5 years.

There are currently no videos available.

Currently, no information for the application is available.



You might be interested in:

StripAid™ X Solvent

StripAid™ X Solvent is a biodegradable hydrocarbon used for debonding the temporary adhesive WaferGrip. The non-hazardous…

DXB 880 Series Wafer Bonder

The DXB 880 features an onboard process controller that automates the entire wafer bonding process. Key…

DXB 120 Series Wafer Bonder

The DXB 120 is used for process development and small-scale production. With its larger heated vacuum…


Product Enquiry Form

    opens our Privacy Policy
  • This field is for validation purposes and should be left unchanged.