WaferGrip™ Adhesives

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StripAid™ X Solvent

StripAid™ X Solvent of dynatex is a biodegradable hydrocarbon used for debonding the temporary adhesive WaferGrip.…

Product Type:

Parts & Consumables



Product Description:

WaferGrip™ Adhesives are advanced composite film adhesives engineered to bond wafers, thin film heads, optics and other substrates during dicing, grinding, lapping and polishing.

WaferGrip™ Adhesives consist of Ethylene Vinyl Acetate (EVA) polymers. WaferGrip™ is heat activated to bond two surfaces together. A typical application is the bonding of wafers to mounting substrates for the thinning process. WaferGrip™ preformed shapes are manufactured to suit the required application. An accurately controlled bond line provides an efficient and robust process. WaferGrip™ preformed shapes are available in three formulations: Standard, Conductive and High Temp.

WaferGrip Adhesives are available in three configurations:

  • WaferGrip™ on Release Paper, used for many standard applications including wafer dicing and wafer thinning.
  • WaferGrip™ on Protective Overlay, used as a temporary substrate that allows the user to cut through the wafer into the substrate below.
  • WaferGrip™ on Double Sided Protective Overlay.

Process Method:

  1. WaferGrip™ Adhesives are removed from the release paper then applied at room temperature to a mounting substrate such as sapphire or glass.
  2. The part or wafer is placed over the WaferGrip.
  3. The entire assembly is then heated to around 110°C – 230°F for 30 to 60 seconds with light pressure, using a vacuum chamber for void free bonding.
  4. To remove WaferGrip™, use our specially formulated solvent StripAid X Solvent.

WaferGrip™ Adhesives are resistant to:

  • Water
  • IPA
  • Acetone
  • KOH etch solutions
  • Photoresist strippers

Use our specially formulated StripAid X Solvent from dynatex to remove WaferGrip™.

WaferGrip Temporary Adhesive Properties Test Method Standard WaferGrip Conductive WaferGrip High Temp WaferGrip
Softening Point (°C/°F) ASTM-D-36 98/208 98/208 115/239
Recommended Bond Temperature (°C/°F) N/A 100-120 / 212-248 100-120 / 212-248 120-140 / 212-284
Lap Shear Strength (psi) (Al to Al) ASTM-D-1002 400 395 490
Ultimate Strength (psi/KPa) ASTM-D-3574-E 120/827 714/4922 517/3565
C.T.E -70°C to 49°C (μm/°C) ASTM-E-831 133.3 140.0 147.9
Volume Resistivity (ohms-cm) ASTM-D257 1.6E+14 8.8E+13 1.6E+14
% Volatiles EPA Method 16 Negligible Negligible Negligible
Color N/A Blue Purple Green

WaferGrip™ is available in the following thickness ranges:

  • 0.8 +/- 0.15 mil – 20 μm +/- 4 μm
  • 1.35 +/- 0.15 mil – 34 μm +/- 4 μm
  • 2.00 +/- 0.20 mil – 50 μm +/- 5 μm

Store under cool, dry conditions away from direct sunlight. Proper storage temperatures range from –5°C/23°F to 24°C/75°F. For best results, keep unopened WaferGrip in the original sealed bag with desiccant. Shelf life at 25°C/ 77°F and 45% humidity is approximately 1.5 years.

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