Product Type:
Parts & Consumables
Application:
Bonding
Product Description:
StripAid™ X Solvent of dynatex is a biodegradable hydrocarbon used for debonding the temporary adhesive WaferGrip. The non-hazardous formulation makes StripAid™ X Solvent a popular choice for processes in which environmental impact is a particular concern. StripAid™ X Solvent can be used at ambient or elevated temperature and with ultrasonic agitation.
Perfect matched to WaferGrip™ Adhesives from dynatex.
Specifications
| Specific Gravity @ 68°F | 0.97 |
| Density @ 68°F (lbs/gallon) | 8.1 |
| Solubility in Water | Negligible |
| Water Solubility in Strip Aid @25°C (% by weight) | 0.2 |
| Absolute Viscosity 68°F (cSt) | 55 |
| Flash Point (°C) | 212 |
| Vapor Pressure | Negligible |
| Color | Cloudy |
| Odor | Mild |
| Other | Contains no animal by-products |
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StripAid X Solvent is specially formulated to remove WaferGrip Adhesives. The recommended process steps are:
- Soak in StripAid at 110° C for 5 to 20 minutes
- Soak in clean StripAid at 110° C for 5 to 20 minutes
- Acetone rinse
- IPA rinse
- DI water rinse