YM-S1-M Wafer Spin Cleaning Machine

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Product Type:



Wet Process

Product Description:

Manual PVA brush based single wafer cleaning equipment:

  • able to process 3/4/6/8/12 inch wafers
  • wafer chucked by pin chuck or vacuum chuck
  • DIW based cleaning
  • spot ultrasonic wave
  • PVA brush

  • up to 2000rpm
  • N2 blow
  • Clean Air blow
  • class 100
  • washing time about 2min
  • Drying time about 10s

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