By NDS
Supplier Info
Product Type:
Equipment
Application:
Wet Processing
Product Description:
Manual PVA brush-based single-wafer cleaning equipment:
- Able to process 3/4/6/8/12″ wafers
- Wafer chucked by pin chuck or vacuum chuck
- DIW based cleaning
- Spot ultrasonic wave
- PVA brush
- Up to 2000 RPM
- N2 blow
- Clean Air blow
- Class 100
- Washing time about 2 min
- Drying time about 10 s
file_downloadNDS-Auxiliary-Equipment.pdf
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