By TEIKOKU
Supplier Info
Product Type:
Equipment
Application:
(De-)Taping • Mounting • Curing
Product Description:
Features
- UV irradiation equipment for dicing tape. For wafers up to 300 mm.
- All parameters important for UV irradiation can be controlled in the recipe.
- Settings can be quickly changed to process different wafer/frame sizes.
- Longer-lasting UV lamp realized by TTS’s proprietary UV technology.
- Other optional features are available.
| Power | AC200-240 V |
|---|---|
| Single Phase Power Consumption | 3 KVA [with UV] |
| Clean Air Pressure (CDA) | 0.5 – 0.6 MPa (Min Flow Rate: 120 NL/min) |
| Vacuum | 650 – 750 mmHg (Min Flow Rate: 60 NL/min) |
| Nitrogen (For UV) | 0.2 – 0.4 MPa (Min Flow Rate: 20NL/min) |
| Exhaust Duct Capacity | 1.0 m3/min, 10 mm H20 (100 mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension(WxDxH mm) | 1350×1250×1800 |
|---|---|
| Net Weight | Appx 500 kg |
The semi-automatic model is also available. Please contact us for details.
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