By ONTO INNOVATION (DACH, Benelux, North France)
Supplier Info
Product Type:
Metrology & Handling
Application:
Optical Surface Inspection
Product Description:
The Celero PL system is designed to meet the growing demand for subsurface defect inspection and classification of silicon carbide (SiC), gallium nitride (GaN) wafers, and other compound semiconductor materials. It features a laser-based phase detection and imaging technology, combining custom optics with advanced image processing algorithms to ensure best-in-class throughput and sensitivity at the lowest cost of ownership per pass.
To support both R&D and high-volume production, the system is available with a range of wafer handling options, allowing for flexible integration into different manufacturing environments. By utilizing multiple light sources and sensor channels, it can accurately detect, measure, and image subsurface crystalline defects in bulk wafers and epitaxial layers. Additionally, it identifies surface particles, scratches, pits, contamination, stains, localized or bulk wafer stress, voids, and inclusions — including edge chips and cracks — ensuring comprehensive defect inspection.
Manual or fully automated open cassette or EFEM for 100–300 mm wafers
- Wafer sizes: 100–300 mm
- Five detection channels: photoluminescence, polarization, slope, bright field, and dark field
- All-surface scan (FS/BS/Edge) and imaging with sub-nanometer sensitivity
- Particle defect (≥ 90 nm PSL) / surface contamination (≥ 5 Å)
- Thin (≥ 100 µm) and thick (≤ 10 mm) wafer
- Multiple handling options: wafer, film frame
- Multiple load options: manual, automated open cassette, EFEM
- Online and offline review capability
- Automated Image-Based Defect Classification
- Compatible with Discover® ecosystem
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