Product Type:
Equipment
Application:
Dry Processing & UHP
Product Description:
The C2200 CO2 Cleaning System from IMT is a state-of-the-art solution designed for the effective removal of contaminants from PCBs, trays and glass. Leveraging advanced CO2 cleaning technology, this system ensures thorough cleaning while preserving the integrity of sensitive electronic components.
Key Features:
- Automated Cleaning Process: The C2200 features a fully automated cassette loading and unloading system, streamlining operations and enhancing productivity in high-throughput environments.
- Effective Contaminant Removal: Utilizing high-pressure CO2 jets, the system effectively eliminates dust and residues, ensuring a pristine surface for optimal performance.
- User-Friendly Interface: The intuitive control system allows for easy operation, making it accessible for all users and minimizing training time.
- Compact and Efficient Design: The compact footprint of the C2200 ensures easy integration into existing workflows without sacrificing valuable space.
Ideal for manufacturers seeking an efficient and reliable cleaning solution, the C2200 CO2 Cleaning System enhances cleaning performance while reducing operational costs. Experience the difference with IMT’s innovative technology, tailored for the demands of modern PCB, tray and glass cleaning.
CO₂ Cleaning Technology
CO₂ Cleaning Mechanism
- Physical Blasting
Dry ice particles are accelerated by compressed air and collide to the surface - Thermal shock
Sublimation heat of -78.5℃ shrinks foreign matters and causes cracks - Sublimation expansion
Expands volume to 800 times and breaks the boundary - Ablation
Uses the air pressure of the high-speed compressed air to remove
Dry-ice (Size: variable) + CDA (Clean Dry Air)
Advantages of the CO2 Cleaning
- Free from chemicals/water
- No need for an additional drying process
- Minimum secondary waste after cleaning
- Free from surface damages
- Easy automation
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Applications in Semiconductor/MEMS:
- TSV
- MEMS Wafer Particle Removal
- Bare Wafer Epoxy
- PR residues Cleaning or Organics Contaminations and residues Cleaning
- Bump Wafers and Removal of Bond Residues
- Glass Carrier Cleaning
- Wafer Backside Cleaning
- EdgeContaminations Cleaning
- Framed Wafers Cleaning after Dicing