IMT develops and produce Dry Cleaning systems based on 2 technologies:

Laser Cleaning Mechanism

Dry Cleaning technique which removes contaminants selectively from the surface by inducing a proper laser-contaminants interactions.
Pulsed LASER vaporizes contaminants from the surface

Advantage of Laser cleaning

  • Precise cleaning Selective removal of contamination only
  • Dry and Safe Cleaning No chemical agent, Environment friendly
  • Remote & Non-Contact Cleaning, Flexible & No mechanical load
  • Fast & Simple Cleaning, No Post-cleaning process and simple system.

 

CO₂ Cleaning Technology

CO₂ Cleaning Mechanism

Physical Blasting Dry ice particles are accelerated by compressed air and collide to the surface
Thermal shock Sublimation heat of -78.5℃ shrinks foreign matters and causes cracks
Sublimation expansion Expands volume to 800 times and breaks the boundary
Ablation Uses the air pressure of the high-speed compressed air to remove

  • Dry-ice ( Size : variable ) + CDA ( Clean Dry Air )

Advantages of the CO₂ Cleaning

Free from chemicals/water
No need for an additional drying process
Minimum secondary waste after cleaning
Free from surface damages
Easy automation

Depending on the application, different nozzles are available from the micron size *soft processes* up to mm for aggressive heavy-duty cleaning.

Dry Ice Size Technology

CO₂ Cleaner Type

Nozzle Type

Max. Dry Ice Size

MicroJet® Cleaner
Very precise, Large area uniformity Cleaning / Model : SM201 / SM202 / SM204 Micro Soft 30 ㎛
Micro Hard 150 ㎛
Micro Super 300 ㎛

Snow CO₂ Jet Cleaner
Precision Cleaning /Model : S201 / S202 Soft 50 ㎛
Power 200 ㎛

Super Snow CO₂ Jet Cleaner
General Cleaning / Model : SS201 Super 700 ㎛
Super Plus 1000 ㎛

Pellet CO₂ Jet Cleaner
Heavy duty cleaning / Model : P301 / P302 Granule Less than 1.5mm
Standard 3mm (Fixed)

Different systems are available for the Semiconductor industry

http://www.imt-c.co.kr/eng/