
IMT develops and produce Dry Cleaning systems based on 2 technologies:
Laser Cleaning Mechanism
Dry Cleaning technique which removes contaminants selectively from the surface by inducing a proper laser-contaminants interactions.
Pulsed LASER vaporizes contaminants from the surface
Advantage of Laser cleaning
- Precise cleaning Selective removal of contamination only
- Dry and Safe Cleaning No chemical agent, Environment friendly
- Remote & Non-Contact Cleaning, Flexible & No mechanical load
- Fast & Simple Cleaning, No Post-cleaning process and simple system.
CO₂ Cleaning Technology
CO₂ Cleaning Mechanism
Physical Blasting Dry ice particles are accelerated by compressed air and collide to the surface
Thermal shock Sublimation heat of -78.5℃ shrinks foreign matters and causes cracks
Sublimation expansion Expands volume to 800 times and breaks the boundary
Ablation Uses the air pressure of the high-speed compressed air to remove
- Dry-ice ( Size : variable ) + CDA ( Clean Dry Air )
Advantages of the CO₂ Cleaning
Free from chemicals/water
No need for an additional drying process
Minimum secondary waste after cleaning
Free from surface damages
Easy automation
Depending on the application, different nozzles are available from the micron size *soft processes* up to mm for aggressive heavy-duty cleaning.
Dry Ice Size Technology
CO₂ Cleaner Type |
Nozzle Type |
Max. Dry Ice Size |
MicroJet® Cleaner |
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Very precise, Large area uniformity Cleaning / Model : SM201 / SM202 / SM204 | Micro Soft | 30 ㎛ |
Micro Hard | 150 ㎛ | |
Micro Super | 300 ㎛ | |
Snow CO₂ Jet Cleaner |
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Precision Cleaning /Model : S201 / S202 | Soft | 50 ㎛ |
Power | 200 ㎛ | |
Super Snow CO₂ Jet Cleaner |
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General Cleaning / Model : SS201 | Super | 700 ㎛ |
Super Plus | 1000 ㎛ | |
Pellet CO₂ Jet Cleaner |
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Heavy duty cleaning / Model : P301 / P302 | Granule | Less than 1.5mm |
Standard | 3mm (Fixed) |
Different systems are available for the Semiconductor industry
http://www.imt-c.co.kr/eng/