By ONTO INNOVATION (DACH, Benelux, North France)
Supplier Info
Product Type:
Metrology & Handling
Application:
Optical Surface Inspection
Product Description:
The PrimaScan™ series of wafer and panel-level tools provides comprehensive all-surface contamination and defect inspection for opaque, transparent, and semi-transparent wafers, reticles, and panel-level substrates.
Designed to meet the R&D and high-volume production needs, the PrimaScan™ series delivers high throughput and sensitivity while ensuring the lowest cost of ownership per pass. Its advanced imaging capabilities enable precise defect detection, making it a reliable solution for semiconductor and microelectronics manufacturing.
PrimaScan™ P System
Optimized Inspection for Advanced Packaging Panel Substrates
As the advanced packaging market shifts from copper-clad laminates (CCL) to glass substrates, the industry must enhance substrate monitoring processes to detect killer defects or latent defects that could lead to yield loss or scrapped panels later in the production flow. The PrimaScan™ P system is specifically engineered to address incoming glass panel quality control challenges for both advanced IC substrate (AICS) and fan-out panel-level processing (FOPLP) applications, supporting the rapid evolution of advanced packaging technologies.
The PrimaScan™ P system utilizes a proprietary laser-based scanning and imaging technique, integrating advanced optics and sensing technologies for high-precision inspection of nanometer-sized defects across various glass substrate sizes. Designed for both R&D and high-volume manufacturing, the system employs multi-channel inspection technologies to detect, measure, and image surface particles, scratches, pits, contamination, stains, film or bulk panel stress, voids, and inclusions—including edge chips and cracks.
Manual load and optional EFEM for ≤ 600 x 600 mm panels
- Panel sizes: ≤ 600 mm x 600 mm
- Four detection channels: polarization, slope, bright field, and dark field
- All-surface scan (frontside/backside/edge) and imaging with sub-nanometer sensitivity
- Particle defect ≥ 150 nm PSL / surface contamination ≥ 5 Å
- Simultaneous frontside / backside inspection (transparent & semi-transparent substrates ONLY)
- Thin (≥ 100 µm) and thick (≤ 5 mm) panel handling
- Multiple load options: manual, EFEM
- Automated Image-Based Defect Classification
- Online and offline review capability
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