By TEIKOKU
Supplier Info
Product Type:
Equipment
Application:
(De-)Taping • Mounting • Curing
Product Description:
- Wafer tape mounting for 300 mm/12″ wafers (optionally available: 200 mm/8″ wafers)
- Parameters for attaching a wafer onto a frame can be controlled in the recipe
- Also suitable for ultra-thin wafers (such as shaped or reworked wafers)
- Inline UV irradiation and BG de-taping features available (optional)
- Longer-lasting UV lamp realized by TTS’s proprietary UV technology
- Several features are available
| Power: | AC200-240 V |
| Single Phase Power Consumption: | 2 KVA (without UV) / 3 KVA (with UV) |
| Clean Air Pressure (CDA): | 0.5 – 0.6 MPa (Min Flow Rate: 120 NL/min) |
| Vacuum | 650 – 750mm Hg (Min Flow Rate: 60 NL/min) |
| Nitrogen (for UV) | 0.2 – 0.4 MPa (Min Flow Rate: 20 NL/min) |
| Exhaust Duct Capacity | 1.0 m3/min, 10 mm H20 (100 mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension (WxDxH) | 1900×2500×1900 mm |
| Net Weight | Appx 1800 kg |
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