Semiconductor / Mems

SXR800X Semi-Automatic Tape Remover

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Supplier Info

Laser Cutting with heating roller and table and digitally adjustable high-pressure performance. Removes tape from wafers…

Laser Cutting with heating roller and table and Digitally adjustable high-pressure performance. Removes tape from wafers…

Product Type:

Equipment

Application:

(De-)Taping • Mounting • Curing

Product Description:

Semi-Automatic Tape Remover.

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Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.

Laser Cutting with heating roller and table and digitally adjustable high-pressure performance. Removes tape from wafers…

Laser Cutting with heating roller and table and Digitally adjustable high-pressure performance. Removes tape from wafers…

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