By MILLICE
Supplier Info
Product Type:
Parts & Consumables
Application:
Chemicals & Photoresists, Sägen
Product Description:
KerfAid™ Dicing Fluid is the original dicing fluid, setting industry standards for over 50 years for wafer dicing performance, process reliability, and reducing dicing costs.
Key Features:
- Reduces chipping, cracking, and backside chip-out.
- Reduces blade loading and lubricates kerf to extend blade life.
- Multi-surfactant formula prevents debris from reaching the wafers surface.
- Maintains clean bond pads to reduce bond failures.
- Includes antibacterial agents to reduce microbial growth in feed lines.
- Reduces ESD by minimizing static build-up at the cut site.
- Forms a non-ionic protective layer to prevent corrosion on bond pads.
- Additional corrosion inhibitor available for specific applications.
Consultation available to meet unique process requirements.
| Form: | Liquid concentrate |
| Appearance: | Transparent, colorless liquid |
| Undiluted pH: | ~ 2-10 (depending on formulation) |
| Dilution Range: | 1:500 to 1:7,000 (depending on formulation) |
| Corrosion Inhibitor: | Optiona |
| Biological Additives: | Antibacterial agents to suppress microbial growth |
| Shelf Life (unopened): | 12 months (store in cool, dry place |
| Shelf Life (opened): | 1 mont |
| Free of: | Phosphates, chlorides, fluorides, and organic gunk-forming materials |
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- Reducing mechanical stress during wafer dicing
- Reducing Blade Wear and Replacements
- Corrosion Protection
- ESD Reduction
- Material Types: Si, SiC, sapphire, GaN, GaAs, glass, QFN, InP and more