Product Type:
Equipment
Application:
Grinding/Dicing
Product Description:
The HiSpec XP Injector is a state-of-the-art injector system designed for automated premixing and delivery of dicing fluid in mid to high volume wafer dicing environments. It draws directly from a fluid container, dilutes to ratios up to 1:10,000, and distributes the mixture to as many as four dicing saws.
Key Features:
- Automated premixing of dicing fluid with DI water for using additive concentrates and high dilution applications.
- Supports up to four dicing saws from a single supply source.
- Real-time monitoring of DI water and fluid levels.
- Built-in alerts for low dicing fluid level, system faults, or flow interruptions.
- PLC-based control system with HMI touchscreen interface.
- Integrated leak detection and emergency shutoff.
- Dosing pauses automatically when cutting is paused
- Communicates with the saw to prevent operation without dicing fluid
- Modular design for easy maintenance and part replacement.
- Robust wheels make it easy to move around the factory
- Optional integration with centralized factory control systems.
| Saw Connections: | Up to 4 saws |
| Dilution Range: | 1:500 to over 1:10,000 |
| Pump Type: | CE-certified metering pumps for precise premix and postmix control |
| Monitoring & Control: | DI water flow sensor, Dosing sensor with countdown timer, Dicing fluid level sensor, Leak detection, HMI touchscreen with integrated PLC |
| Wheels for easy repositioning in your facility | |
| Enclosure Material: | Fully welded with 10mm Polypropylene (PP), Natural PP |
| Dimensions: | 1310 mm (H) x 400 mm (W) x 800 mm (L) |
file_downloadmillice-hispec-xp-brochure.pdf
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- Automated dicing fluid dosing for mid and high-throughput wafer dicing
- Ideal for cleanroom environments with multiple saws
- Supports cutting process es for Si, SiC, sapphire, GaN, GaAs, glass, QFN, InP, and more
- Upgrade available for compatibility with automated systems