By TEIKOKU
Supplier Info
Product Type:
Equipment
Application:
(De-)Taping • Mounting • Curing
Product Description:
- A wafer mounter for wafers up to 200 mm (4″, 5″, 6″, and 8″)
- Parameters for attachment can be controlled in the recipe.
- Can be used with thinner/ bumpy wafers.
- Several features are available.
The semi-automatic model is also available. Please contact us for details.
| Power: | AC200-240 V, Single Phase |
| Power Consumption: | 2 KVA |
| Clean Air Pressure (CDA): | 0.5 – 0.6 MPa (Min Flow Rate: 120 NL/min) |
| Vacuum | 650 – 750 mm Hg (Min Flow Rate: 60 NL/min) |
| Exhaust Duct Capacity | 5.0 m3/min, 40 mm H20 (100 mm diameter SUS Flange duct connection) |
System Arrangement
| Dimension (WxDxH) | 1830×1050×1800 mm |
| Net Weight | Appx 1000 kg |
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- Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.