By TEIKOKU
Supplier Info
Product Type:
Equipment
Application:
(De-)Taping • Mounting • Curing
Product Description:
DXL2-800CS-LSR-CE
The Fully Automatic 200 mm Wafer Laminator system TTS Model: DXL2-800CS-LSR-CE series is a Machine for Fully Automatic 200mm wafer to wafer or substrate Laminator using New Generation Laser Cutting technology for almost kind of BG tape or sticky UV tape, which has double sided separator or either single sided separator as well.
Laser Cutting with heating roller and table and digitally adjustable high-pressure performance designed for Bumping, wafer level CSP manufacturing, and special MEMS manufacturing process. TTS’s unique worldwide patented laser cutting system provides maintenance-free and accurate BG Tapes and lamination without wafer damage, and notch-shaped wafers can be processed. The model DXL2-800CS-LSR-CE is designed to apply single and double-sided separator conversion by touch panel selection easily.
System Basic Concept and features
1. High-performance lamination with double or single separator Tape
2. Applicable up to 200 mm size wafer damage free and wafer holding with Good Accuracy Heater
3. Easy tape setting for the air chucking system.
4. Perfect safety features by using both the cover inter-locking system and Optical Area sensors.
5. The wide LCD Full-color touch panel leads operator’s easy operation.
6. Fully digitally controlled Laminate Roller & Process Controller applicable for accurate and secured lamination for active wafer surface.
7. Adjustable Digitally controlled Laminate pressure roller and table temperature assume a wider range for almost kinds of BG Tape laminating.
Machine Utilities
| Power: | AC200-240 V, Single Phase |
| Power Consumption: | 3 KVA |
| Compressed Air: | 0.55 MPa (79 PSI) (Min Flow Rate: 120 NL/min) |
| Vacuum | 650 mm Hg (Min Flow Rate: 60 NL/min) |
System Arrangement
| Dimension (WxDxH) | 1250×1400×2200 mm |
| Net Weight | Appx 800 kg |
| Equipment Safety Standard | CE Compliant, S2-2000 certified, FDA Certificate (USA Law) |
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- Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.