By MILLICE
Supplier Info
Product Type:
Equipment
Application:
Grinding/Dicing
Product Description:
The HiSpec XA1 Injector is a compact, saw-side injector system designed for precise dosing of dicing fluid in wafer dicing applications. It supports single-saw operation and is well-suited for labs and compact production environments.
Key Features:
- Supports a single dicing saw
- Real-time monitoring of DI water and dicing fluid levels
- Integrated fluid and flow sensors with emergency shutoff
- Dosing pauses automatically when cutting is paused
- Minimal footprint for space-constrained environments
| Saw Connections: | 1 saw per injector |
| Flow Rate Range: | 1–33 ml/min |
| Dosing: | CC per Stroke: Min: 0.06ml/stroke (0.095 GPH), Max: 0.19ml/stroke (0.052 GPH), Stroke |
| Speed: | Min: 18 strokes/min, Max: 180 strokes/min |
| Pump type: | CE-certified metering pump |
| Container Compatibility: | 1 gal, 1.25 gal, 5 gal containers |
| Dimensions: | 550mm (L) x 400mm (W) x 800mm (H) |
| Material: | Enclosure: Fully welded with 10mm Polypropylene (PP), Natural PP |
file_downloadmillice-hispec-xa1-brochure.pdf
There are currently no videos available.
- Precise dicing fluid dosing for wafer dicing
- Ideal for R&D or low-to-mid volume production
- Supports cutting processes for Si, SiC, sapphire, GaN, GaAs, glass, QFN, InP, and more