By CN1
Supplier InfoProduct Type:
Equipment
Application:
ALD
Product Description:
Erhältlich für 4“ bis 12“ Wafer
- Batch-Vertikalofen ALD
- Substratgröße: 4 ~ 12” Wafer
- Wafer pro Run: 25 EA / 50 EA (bis zu 100 EA)
- Bootsschlitzabstand: 10 ~ 15 mm
- Auf / Ab & Wafer-Rotation
- Manuelle / automatischer Wafertransfer, -loading
- Zonentemperaturregelung
- Prozesstemperatur: 400 ~ 800 ° C.
- Ramping-Up : > 10 ℃/min
- Ramping-Down: 2 ~ 3,3 ℃ / min
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