Product Type:
Equipment
Application:
(De-)Tapen • Mounting • Aushärten
Product Description:
Wafer MOUNT & BG Tape REMOVER Multi-Function system with In-line LED UV irradiator TECHNICAL SPECIFICATION
Features
- Wafer Size: Up to 8″ (specify wafer type before issuing the PO)
- Load Capacity One (1) TTS Original Cassette Station
- Unload Capacity: One (1) Unload Magazine Station
- Cassette: SEMI Standard Open Cassette (Use Even slot only if using Bernoulli finger: or DSC
- Frame Magazine: SEMI 25 Slots SEMI Standard 6” Frame Cassette: or SEMI 25 Slots SEMI Standard 8” Frame Cassette
- Dicing Frame Type: DISCO Standard DF2-8 or Equivalent Frame Vender (specify wafer type before issuing the PO)
- UPH: 15 – 20 WPH (UPH depends on recipe setting)
- Mounting Tape: Normal Roll shape tape (UV & non-UV tapes) or Pre-Cut Type tape (option)
- Remove Tape: Heat Seal tape Removal Function for BG Tape removal
- CCD none contact alignment: CCD sensor and Bernoulli Finger type alignment for thin wafer
- Long-life Roller Blade: A newly designed Roller Cutting Blade lasts up to 100,000 times. (Applicable for normal roll tape)
- Heater Capability: Max 60 degree C±3 degree C @ Mount Heat Roller: Max 60 degree C±3 degree C @ Wafer stage with Soft Si Table: Room Temp (Roller Cutter)
- Big LCD Touch Screen: Big color screen for user-friendly and easy operations.
- System Recipe capacity: 100 (max)
- Advanced Maintenance Design: Minimum-lubrication, Easy maintenance designs.
Wafer Mount & BG Tape Remove Function
- Removing Module for BG Tape: Heat Seal tape Removal Function for BG Tape removal: Maximum applicable tape width: 75 mm
- Soft Si Rubber Mount Table: Applicable Soft Silicone rubber Universal Table (With Full ESD controlled contacts) Soft Silicone rubber table achieves highly secured wafer holding during Dicing Tape Lamination
- Remove Table: Applicable Ceramic Universal Table for BG Tape Remove
Ceramic Remove Table
Soft SI Mount Table
- Frame Stock Station: Frame Stock station equipped with frame Stock Detection and double frame detection
- Applicable Mounting Tape Width: 8” Frame > 295 mm (min) 330 mm (max)
Optional Function
- Thin Wafer Capability: Micro Bernoulli Finger can handle Thin wafer
- Wafer Mapping Capability: Applicable Intellige nt Wafer Mapping at Loading Station
- In-Line LED UV Irradiator: Intelligent LED UV irradiation methods UV Lamp Life Guaranteed 1 5,000 hours)
- SECS/GEM: Applicable TTS Standard SECS/GEM capability following SEMI Stand
- Frame Barco de Print & Reader: Applicable Integrated Frame barcode reader by Keyence, Printer by SATO.
- Wafer ID OCR: High-performance OCR Vision Engine by (Option must place PO together with equipment).
System Dimensions & Utilities
- Dimensions : 1900mm (W) x 2500 mm (D) x 1900 mm (H)
- Weight : ≈ 1800 kg
- Required Power: 200-240 V, 3 KVA Single Phase
- Compressed Air: 0.6 MPa (70 PSI) Minimum 120 NL/min
- Vacuum Source: Minimum 600 mmHg 60 NL/min
file_downloadTTS-Fully-Automated-Wafer-Mountor-with-3-in-1-Function_EXM-800CS-LUVR-CE-V1_For-TDK-Micronas_200921.pdf
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