Produkttyp:
Equipment
Anwendung:
(De-)Tapen • Mounting • Aushärten
Produktbeschreibung:
EXL2 Vollautomatisches 300 mm Wafer Tape Laminiergerät
There are currently no specifications available.
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- Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.