Product Type:
Equipment
Application:
CMP
Product Description:
Axus Technology provides advanced CMP tools and technology, along with exceptional technical expertise for polishing, wafer cleaning, precision wafer grind processing, and legacy tools; making us one of the best highly specialized technology suppliers and consulting services focused on engineering capability and efficiency in supporting the CMP market.
The Applied Materials Mirra CMP Tool is a Dry In – Wet Out (DI-WO) type of CMP machine which incorporates three polishing platens. The four wafer carriers are supported by a carousel transfer mechanism that moves the wafers through a one, two, or three step polishing process. This AMAT CMP polisher will process wafers from 150 to 200mm in diameter, and can be used for the planarization of thin films such as oxide, tungsten, and Polysilicon.
AMAT Mirra Track CMP System – provides Dry In-Dry Out (DIDO) processing and is integrated with the OnTRAK “Integra” double sided wafer cleaning system.
AMAT Mirra Mesa CMP System – provides fully automated Dry In-Dry Out (DIDO) processing and is integrated with the MESA cleaner. A FABS unit is added that can accommodate up to four 25-wafer cassettes.
Click for details of the AMAT Mirra Mesa CMP System
AMAT Mirra DNS CMP System – integrated with the DNS AS-2000 Post-CMP cleaning tool and includes the FABS (Factory Automation Buffer Station) and an LTA (Linear Transfer Assembly).
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This AMAT CMP polisher can be used for the planarization of thin films such as oxide, tungsten, and Polysilicon.