By KOVIS Technology
Supplier Info
Product Type:
Metrology & Handling
Application:
Dimensionelle Wafer-Messtechnik
Product Description:
High Speed C-SAM Inspection System
ATLANTIS™ is an advanced high-speed C-SAM (Confocal Scanning Acoustic Microscopy) inspection system designed for non-destructive analysis of semiconductor components. Utilizing high-frequency ultrasonic wave measurement, it enables precise detection of internal defects such as delamination, cracks, and voids within complex semiconductor structures.
Key Features:
Ultrasonic Wave Measurement: Provides high-resolution internal imaging through acoustic reflections, ideal for deep structural analysis.
SAT Scanning Method: Employs Scanning Acoustic Tomography (SAT) for layer-by-layer inspection, ensuring accurate defect localization.
Semiconductor PKG Defect Mode: Specifically optimized for detecting typical failure modes in semiconductor packages (PKGs), including voids and delaminations.
Comprehensive Coverage: Supports inspection of advanced packaging technologies such as High Bandwidth Memory (HBM), Through-Silicon Vias (TSVs), and wafer-to-wafer bonding.
Confocal Imaging: The confocal acoustic approach ensures only signals from the focal plane contribute to the image, enhancing depth resolution and minimizing noise.
ATLANTIS™ is the ideal choice for manufacturers seeking fast, reliable, and highly accurate inspection of next-generation semiconductor devices.
| Samples for: | Up to 300 mm wafers |
| Transducer: | 25MHz ~ 400MHz, 1GHz UHF transducer |
| Pulser/Receiver: | 4-channel pulser/receiver interface with 500 MHz bandwidth delivers high-performance data acquisition Capabilities |
| 4 integrated ADC board (analogue digital converter): | With 1GSPS sampling and 4 channels, this system offers a digital oscilloscope, A-scan interface, and multiple scanning modes for precise signal capture, analysis, and visualization |
| Dual Synchro Multi-transducer: | 2x or 3x synchronized multi-transducer simultaneous scanning acoustic microscopy technology |
| Scanning System: | High-performance 2-axis scanning system uses a digital linear motor drive with opto-mag encoders |
| Scanning range: | XY raster scan : 320mm x 320mm |
| Maximum scan speed: | 1,2 m/sec |
| Repeatability: | ≤±1.5 µm/full travel |
| AI based deep learning image optimization: | Cutting-edge deep learning AI technology delivers outstanding image quality enhancement for accurate and efficient defect analysis. |
| Graphical User Interface: | Powerful software, featuring an intuitive graphical user interface on a Windows® 10 platform. |
| EFEM Automation Platform: | Dual Load port module (N2 purging optional) with dual arm robot. |
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- HBM
- TSV
- Bonded Wafer
- MEMS (Bonded Wafer & Cavity seal)
- SSL LED
- Bare wafer