Product Type:
Equipment
Application:
Schleifen/Sägen
Product Description:
The HiSpec XI Injector is a modern injector system designed for direct dosing of dicing fluid into the DI water line for wafer dicing operations. It supports up to four saws and is suitable for mid to high volume cleanroom environments.
Key Features:
- Supports up to four dicing saws from a single supply source
- Real-time monitoring of DI water and dicing fluid levels
- Built-in alerts for low dicing fluid level, system faults, or flow interruptions.
- PLC-based control system with HMI touchscreen interface
- Integrated leak detection and emergency shutoff
- Dosing pauses automatically when cutting is paused
- Communicates with the saw to prevent operation without dicing fluid
- Modular design with separate electrical and pump compartments for easy maintenance
- Optional integration with centralized factory control systems
| Saw Connections: | Up to 4 saws |
| Pump Type: | CE-certified metering pumps for precise control |
| Monitoring & Control: | Leak detection, Emergency shutoff, Dicing fluid level sensor, DI water flow sensor, HMI touchscreen with integrated PLC |
| Wheels for easy repositioning in your facility | |
| Enclosure Material: | Fully welded with 10mm Polypropylene (PP), Natural PP |
| Dimensions | 1010mm (H) x 400mm (W) x 800mm (L) |
file_downloadmillice-hispec-x1-brochure.pdf
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- Automated dicing fluid dosing for mid and high-throughput wafer dicing
- Ideal for cleanroom environments with multiple saws
- Supports cutting processes for Si, SiC, sapphire, GaN, GaAs, glass, QFN, InP, and more
- Upgrade available for compatibility with automated systems