Product Type:
Equipment
Application:
Trockenprozesse & UHP
Product Description:
The C1100 CO2 Cleaning System from IMT is a cutting-edge solution designed for the efficient removal of contaminants from semiconductor wafers. Utilizing advanced CO2 cleaning technology, this system ensures high cleanliness levels, critical for maintaining the quality and performance of sensitive components.
Key Features:
- Effective Contaminant Removal: The C1100 employs a powerful CO2 jet that targets and eliminates particlesf and other residues without damaging delicate surfaces.
- Manual Loading System: Designed for cost-effectiveness, the manual loading feature allows for easy operation while reducing overall expenses, making it an ideal choice for various production environments.
- Compact Design: Its compact footprint allows for seamless integration into existing workflows, maximizing space efficiency in your facility.
- User-Friendly Interface: The intuitive control panel simplifies operation, ensuring that your team can quickly adapt and maintain productivity.
With its combination of performance, efficiency, and ease of use, the C1100 CO2 Cleaning System is the perfect choice for semiconductor manufacturers looking to enhance their cleaning processes and improve product quality.
CO₂ Cleaning Technology
CO₂ Cleaning Mechanism
- Physical Blasting
Dry ice particles are accelerated by compressed air and collide to the surface - Thermal shock
Sublimation heat of -78.5℃ shrinks foreign matters and causes cracks - Sublimation expansion
Expands volume to 800 times and breaks the boundary - Ablation
Uses the air pressure of the high-speed compressed air to remove
Dry-ice (Size: variable) + CDA (Clean Dry Air)
Advantages of the CO2 Cleaning
- Free from chemicals/water
- No need for an additional drying process
- Minimum secondary waste after cleaning
- Free from surface damages
- Easy automation
There are currently no downloads available.
Applications in Semiconductor/MEMS:
- TSV
- MEMS Wafer Particle Removal
- Bare Wafer Epoxy
- PR residues Cleaning or Organics Contaminations and residues Cleaning
- Bump Wafers and Removal of Bond Residues
- Glass Carrier Cleaning
- Wafer Backside Cleaning
- EdgeContaminations Cleaning
- Framed Wafers Cleaning after Dicing