Sirus T2 Table Top RIE

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Product Description:

The Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.

Tool Standard Features

  • Sirus T2 reactor with 200mm bottom electrode
  • System controller (includes Pentium™ based computer and touch screen interface)
  • Two mass flow controllers
  • Automatic tuning with 13.56 MHz 600 watt RF generator
  • Emergency Off system
  • Automatic pressure control package (butterfly valve with capacitance manometer for pressure measurement)
  • 12 month limited warranty

Optional Features

  • Recirculating temperature controller
  • Up to two additional mass flow controllers


  • 170 l/s turbo
  • 23.3 cfm rotary vane pump with oil filtration, demister, and Fomblin oil
  • The Sirus T2 system requires a roughing pump and either a chiller or cooling water with greater than 4 M ohm resistivity.

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  • MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line.
  • Fluorine Etch Processes (SF6, CF4, CHF3, O2)
  • Carbon
  • Si
  • Epoxy
  • SiO2
  • InSb
  • Si3N4
  • Ir
  • SiC
  • Mo
  • Ta
  • Nb
  • TaN
  • OxyNitride
  • TiW
  • Polyimide
  • TiN
  • Pr (e.g: SiLK or SU8)
  • W
  • Quartz

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