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e3611 Single Wafer Plasma Ashing System
e3611 Advanced Single Wafer Plasma Asher The e3600 product line is an advanced plasma ashing/etch system…
e3612 Single Wafer Plasma Ashing System
e3612 Advanced Single Wafer Plasma Asher The e3600 product line is an advanced plasma ashing/etch system…
Product Type:
Equipment
Application:
Etching
Product Description:
e3511 Wafer Ashing System
- True downstream Microwave plasma process ( 24” from the product)
- Fully compatible Process and Chamber with the Gasonics L3510
- Platen Temp enhanced range from 60 to 350 Deg
- Enhanced IDX Flexware® Software Control
- Embedded Intel® i7 multi-core PC with Slice I/O modules
- Ethernet Smart Controls for Pressure control, Robot
and Gas flow controls ( MFC’s) - Flash drive data storage & USB Backup for recipes/data
- SECS/GEM Compliant, HSMS Standard
- Easy-to-Use, Configurable Display
- Easy to see 17” touchscreen
- Built-in watchdog timer for safe operation
- LED status of power and Digital I/O
- Solid State Controls for Lamp and Platen Heater
- New Hatm-5 pick and place robot
- 1.2kw MicroWave power
- Lamp assisted processing for better uniformity and enhanced ash rates
- Substrate sizes 100-200 mm
- Tool Footprint 762 mm (30″) B x 38 mm (38″) T x 58″ (965 mm) (965 mm) T x 58″ (1473 mm) H
- Photoresist strip Typical Throughput 60 WPH
- Ash Rates < 200Å – ≥3,5 μm./min.
- Uniformity within Wafer 2% – 5%
file_downloadESI-e3511-brochure-version-2023.pdf
file_downloade3511-technical-features.pdf
file_downloadIDX-Flexware-RENA-2020.pdf
file_downloade3511-technical-features.pdf
file_downloadIDX-Flexware-RENA-2020.pdf
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- Bulk Resist, Post LDI Resist Strip, Polymer Removal
- Descum processing
- Surface treatment for better Dep Adhesion
- Post high dose implant strip
- Oxidation
- Isotropic etch
- MEMS Applications