Gasonics e3511 Plasma Asher

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By ESI

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Product Type:

Equipment

Application:

Etching

Product Description:

e3511 Wafer Ashing System

  • True downstream Microwave plasma process ( 24” from the product)
  • Fully compatible Process and Chamber with the Gasonics L3510
  • Platen Temp enhanced range from 60 to 350 Deg
  • Enhanced IDX Flexware® Software Control
  • Embedded Intel® i7 multi-core PC with Slice I/O modules
  • Ethernet Smart Controls for Pressure control, Robot
    and Gas flow controls ( MFC’s)
  • Flash drive data storage & USB Backup for recipes/data
  • SECS/GEM Compliant, HSMS Standard
  • Easy-to-Use, Configurable Display
  • Easy to see 17” touchscreen
  • Built-in watchdog timer for safe operation
  • LED status of power and Digital I/O
  • Solid State Controls for Lamp and Platen Heater
  • New Hatm-5 pick and place robot
  • 1.2kw MicroWave power
  • Lamp assisted processing for better uniformity and enhanced ash rates

  • Substrate sizes 100-200 mm
  • Tool Footprint 762 mm (30″) B x 38 mm (38″) T x 58″ (965 mm) (965 mm) T x 58″ (1473 mm) H
  • Photoresist strip Typical Throughput 60 WPH
  • Ash Rates < 200Å – ≥3,5 μm./min.
  • Uniformity within Wafer 2% – 5%

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  • Bulk Resist, Post LDI Resist Strip, Polymer Removal
  • Descum processing
  • Surface treatment for better Dep Adhesion
  • Post high dose implant strip
  • Oxidation
  • Isotropic etch
  • MEMS Applications

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