DXE 5 Series Wafer Expander

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By DYNATEX

Supplier Info

Product Type:

Equipment


Application:

Bonding


Product Description:

The DXE 5 Series Wafer Expander is used for expanding wafers after the singulation/dicing process.

This prevents die edge chipping during shipping or the pick and place operation. We offer both manual and automated expanders to provide a cost effective, easy to perform solution.
The DXE 5 Series Wafer Expander has been optimized to:
  • Expand the space between diced semiconductor die by omni-directional stretching of the plastic film on which these die have been mounted
  • Stretch over concentric hoop sets that retain the stretched plastic films
  • Heat the tape to improve the tape flexibility during the expansion process
  • Provide adjustable temperature to accommodate a wide range of tapes and films

 


Specifications

Product Specifications

Power Required 100/120 VAC 3 amp OR 220/240 VAC 1.5 amp, 50/60Hz
Operating Temperature 150 +/- 5° F (66+/- 2.5° C)
Dimensions Height: 8″ (200 mm), Width: 8.5″ (216 mm), Depth: 12.5″ (315 mm)

There are currently no videos available.

  • Laser Diodes
  • LEDs
  • MEMS
  • Transfer of wafers from film frames to hoops
  • Wafer mounting


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