Product Type:
Equipment
Application:
Bonding
Product Description:
The DXB 525 is Dynatex’s small footprint wafer bonder. Its compact size makes it ideal for experiments and small scale process development.
- Dual chamber technology allows the operator to manually adjust the bonding pressure.
- Heated vacuum chamber 5.25″ diameter.
- On board timer is used to set the bonding process duration.
- Available in two operating voltages – 120 VAC and 240 VAC (both single phase).
| DXB 525 Series | DXB-525-01 | DXB-525-02 |
| Bonding Chamber Size | 132 mm | 132 mm |
| Temperature Range | 100 – 320° F (40 – 160° C) | 100 – 320° F (40 – 160° C) |
| Cycle Time Range | 1 sec – 10 min | 1 sec – 10 min |
| Power Required | 100/120 VAC 5 amp, 50/60Hz; | 220/240 VAC 2.5 amp, 50/60Hz |
| Vacuum Required | 18 – 25 inHg | 18 – 25 inHg |
| Environmental | 60 – 80° F (15 – 27° C); 0 – 95% Humidity (non-condensing) |
60 – 80° F (15 – 27° C); 0 – 95% Humidity (non-condensing) |
| Dimensions | Height: 7″ (180 mm); Width: 9″ (225 mm); Depth: 11.5″ (290 mm); Chuck: 5.25″ (135 mm) |
Height: 7″ (180 mm); Width: 9″ (225 mm); Depth: 11.5″ (290 mm); Chuck: 5.25″ (135 mm) |
file_download191031-DXB-525.pdf
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- Wafer Thinning
- Wafer Lapping
- Metal Plating
- Wafer Polishing
- Wafer Dicing
- Deep Reaction Ion Etch
- Any other temporary wafer bonding process