DXB 525 Series Wafer Bonder

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By DYNATEX

Supplier Info

Product Type:

Equipment


Application:

Bonding


Product Description:

The DXB 525 is Dynatex’s small footprint wafer bonder. Its compact size makes it ideal for experiments and small scale process development.

Features

  • Dual chamber technology allows the operator to manually adjust the bonding pressure.
  • Heated vacuum chamber 5.25″ diameter.
  • On board timer is used to set the bonding process duration.
  • Available in two operating voltages – 120 VAC and 240 VAC (both single phase).

 


Specifications

Product Specifications

DXB 525 Series DXB-525-01 DXB-525-02
Bonding Chamber Size 132 mm 132 mm
Temperature Range 100 – 320° F (40 – 160° C) 100 – 320° F (40 – 160° C)
Cycle Time Range 1 sec – 10 min 1 sec – 10 min
Power Required 100/120 VAC 5 amp, 50/60Hz; 220/240 VAC 2.5 amp, 50/60Hz
Vacuum Required 18 – 25 inHg 18 – 25 inHg
Environmental 60 – 80° F (15 – 27° C);
0 – 95% Humidity (non-condensing)
60 – 80° F (15 – 27° C);
0 – 95% Humidity (non-condensing)
Dimensions Height: 7″ (180 mm);
Width: 9″ (225 mm);
Depth: 11.5″ (290 mm);
Chuck: 5.25″ (135 mm)
Height: 7″ (180 mm);
Width: 9″ (225 mm);
Depth: 11.5″ (290 mm);
Chuck: 5.25″ (135 mm)

file_download191031-DXB-525.pdf

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Applications

  • Wafer Thinning
  • Wafer Lapping
  • Metal Plating
  • Wafer Polishing
  • Wafer Dicing
  • Deep Reaction Ion Etch
  • Any other temporary wafer bonding process


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