Compass SRD Spin Rinse Dryer

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Supplier Info

Product Type:



Wet Process

Product Description:

Designed and built by MEI, the Compass line of Spin Rinse Dryers are top-quality wafer dryers for high and low profile cassettes. The Compass SRD is designed to reduce operating costs while meeting or exceeding all critical areas to include  clean, dry and particle performance specifications. This level of advanced process control can only be found on the Compass SRD. With greater reliability, performance, and low operating cost coupled with MEI’s award-winning support, the Compass Spin Rinse Dryer is the solution you can trust.


  • Multiple wafer sizes for low and high profile cassettes
  • Rotor Type QD, 4 bolt, Verteq (1 rotor per chamber)
  • 10 Nozzle DI spray manifold
  • Programmable set point for N2 heater and temperature monitoring
  • St. Gobain pneumatic valve manifolds (off the shelf from any St. Gobain dist.)Rotor_3
  • DI supply connects directly to DI manifold resulting in no “dead lag” on the DI line.
  • Brushless DC motor with hi-res encoder for monitoring RPM and position control
  • Improved rotor RPM operating range: 0 – 2800 RPM’s
  • Vibration is controlled with Tunable Vibration Dampening.
  • Advanced Process Control with IDX Flexware software
  • 10.4” Color Touch-screen user interface
  • Data logging
  • Resistivity Monitoring with set-points
  • Humidity Monitoring with set-points
  • Insitu Anti-Stat management


  • Lower Operating Costs
  • Improved Performance
  • Advanced Process Control & Monitoring
  • Significant N2 Savings
  • Improved Particle Performance
  • Built with trusted, “off the shelf” components*
  • Intuitive Graphical User Interface

* excluding proprietary components


  • Host Communications & Factory Automation
  • USB Auto-backup
  • Light tower
  • Auto door
  • Humidity sensor
  • Chemical inject
  • Custom chamber designs
  • Custom carrier designs
  • DI Flow meter
  • DI & N2 facility boxes

Low Cost of Ownership

  • Designed to reduce facilities cost in all areas
  • Reduction in N2 usage
  • Reduction of DI water usage
  • Reduction in process cycle times, increased throughput
  • Built using readily available “Off-the Shelf” parts*

* Excluding proprietary components

  • Drying of wafer batch with up to 25 wafers

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