Semiconductor / Mems

Back Grinding Wheel

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By SHINHAN DIAMOND

Supplier Info

Semi-Back-Grinding-Wheel-1-2wqhb5pu21mld1xdgb198g

Product Type:

Parts & Consumables

Application:

Back Grinding Wheel

Product Description:

Back Grinding Wheel

It is a diamond tool for grinding the back side of sapphire wafer, which leads to
an excellent surface finish and life span.

We also offer CMP Pad Conditioners from Shinhan

Specifications
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There are currently no specification available.

There are currently no downloads available.

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Theres currently no information available for application.

Name*
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Phone
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Product Enquiry Form

Name*
First Last
Email*
Company Name*
Company Address*
Enquiry Details*
Product Name
Privacy*
- I have read and agree to the terms and conditions set out in the Privacy Policy
Phone
This field is for validation purposes and should be left unchanged.