DXB 120 Series Wafer Bonder

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By DYNATEX

Supplier Info

Product Type:

Equipment


Application:

Bonding


Product Description:

The DXB 120 is used for process development and small scale production. With its larger heated vacuum chamber, the DXB 120 supports larger wafers.

Features

  • The DXB 120 can be used to develop a process that was created on the DXB 525 but needs to be developed for larger wafers.
  • Dual chamber technology allows the operator to manually adjust the bonding pressure.
  • Heated vacuum chamber 11.25″ diameter.
  • On board timer is used to set the bonding process duration.
  • Available in two operating voltages – 120 VAC and 240 VAC both single phase.


Specifications

Product Specifications

DXB 120 Series DXB-120-01 DXB-120-03
Bonding Chamber Size 79 mm 279 mm
Temperature Range 100 – 320° F (40-160° C) 100 – 320° F (40-160° C)
Cycle Time Range 1 sec – 10 min 1 sec – 10 min
Power Required 100/120 VAC 10 amp, 50/60Hz 220/240 VAC 5 amp, 50/60Hz
Vacuum Required 18 – 25 inHg 18 – 25 inHg
Environmental 60 – 80° F (15 – 27° C)
0 – 95% Humidity (non-condensing)
60 – 80° F (15 – 27° C)
0 – 95% Humidity (non-condensing)
Dimensions Height: 8″ (200 mm);
Width: 15″ (375 mm);
Depth: 17.5″ (440 mm);
Chuck: 11.2″ (285 mm)
Height: 8″ (200 mm);
Width: 15″ (375 mm);
Depth: 17.5″ (440 mm);
Chuck: 11.2″ (285 mm)

file_download191031-DXB-120.pdf

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Applications

  • Wafer Thinning
  • Wafer Lapping
  • Metal Plating
  • Wafer Polishing
  • Wafer Dicing
  • Deep Reaction Ion Etch
  • Any other temporary wafer bonding process


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