EXR2 Vollautomatischer 300mm Bandentferner

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By TEIKOKU

Supplier Info

Product Type:

Equipment


Application:

Taping Detaping Mounting Curing


Product Description:

EXR2 Vollautomatischer 300mm Bandentferner

Wafer-Level CSP-Fertigung und spezielles MEMS-Herstellungsverfahren


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  • Laser Cutting with heating roller and table and Digitally adjustable high pressure performance designed for Bumping, wafer level CSP manufacturing and special MEMS manufacturing process.

 


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