By SECSupplier Info
Metrology & Handling
- Non-destructive analysis system for Wafer Level Packaging
- High resolution image with Dual Type CTs
- TSV, Micro Bump, Pattern
|Nano-focus X-ray Inspection System
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.
Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.
Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
|X-ray Tube||120 kV / 200 µA|
|Min. Resolution||200 nm|
|Table Size||Max : 300 mm (Ø) Wafer 적용|
|AXIS||X, Y, Z, Tilt (70º), R|
|Detector||3.2 M Pixel FPD (Option:6.7M / 10M)|
|CT Scan Method||Oblique CT / Cone beam CT|
|Dimension||1,800(W) x 2,700(D) x 2,670(H)mm / 6,500kg|
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