X-eye NF120 X-Ray Inspection System

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Supplier Info

Product Type:

Metrology & Handling


Application:

Xray Inspection


Product Description:

Nano-focus X-ray

  • Non-destructive analysis system for Wafer Level Packaging
  • High resolution image with Dual Type CTs
  • TSV, Micro Bump, Pattern
Nano-focus X-ray Inspection System
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.
Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.
Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.


Specifications
X-ray Tube 120 kV / 200 µA
Min. Resolution 200 nm
Table Size Max : 300 mm (Ø) Wafer 적용
AXIS X, Y, Z, Tilt (70º), R
Detector 3.2 M Pixel FPD (Option:6.7M / 10M)
CT Scan Method Oblique CT / Cone beam CT
Dimension 1,800(W) x 2,700(D) x 2,670(H)mm / 6,500kg

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Wafer Bump Void
Wafer TSV Void
Applications


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