Wafer Geometry Measurement System UltraMap-BP1

Product Enquiry

Product Enquiry Form

By MICROSENSE

Supplier Info

Product Type:

Metrology & Handling


Application:

Wafer Dimensional Metrology


Product Description:

Manual, Benchtop Wafer Thickness Measurement System

Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution).


  • Samples 2” to 12” (50 to 300mm)
  • Thickness range: 20um to 5mm
  • Automated calibration
  • All materials, all type of surfaces

Options

  • Dual probes
  • Vacuum chuck for ultrathin samples

There are currently no downloads available.

QA and QC of any type of samples, any shape, any thickness range.R&D labs, thickness control after backgrinding.


Product Enquiry Form