Metrology & Handling
Wafer Dimensional Metrology
Manual, Benchtop Wafer Thickness Measurement System
Patented sensing technology with APBP (dual automated positioning backpressure probes) (20nm resolution).
- Samples 2” to 12” (50 to 300mm)
- Thickness range: 20um to 5mm
- Automated calibration
- All materials, all type of surfaces
- Dual probes
- Vacuum chuck for ultrathin samples
There are currently no downloads available.
QA and QC of any type of samples, any shape, any thickness range.R&D labs, thickness control after backgrinding.