Wafer Geometry Measurement System UltraMap-200C

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Product Type:

Metrology & Handling


Wafer Dimensional Metrology

Product Description:

The UltraMap 200C Wafer measurement system precisely measures wafer thickness, flatness and shape using MicroSense’s patented  technology.  The UltraMap 200C is an extremely flexible system since it can measure a wide range of wafer thicknesses and any wafer material.  Wafer surface finish has no effect on the measurement – the UltraMap200 measures as sawn, lapped or polished wafers.

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