Metrology & Handling
Wafer Dimensional Metrology
Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm.
- Dual white light chromatic coding probe technology with 10nm resolution
- Thickness range from 50um to 1mm
- Automated calibration
- Hiscan option for surface roughness and link profile measurement and other surface structures
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Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.