Wafer Geometry Measurement System UltraMap-200B

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By MICROSENSE

Supplier Info

Product Type:

Metrology & Handling


Application:

Wafer Dimensional Metrology


Product Description:

Benchtop automated thickness measurement system with X-Y stage on air bearing for wafers up to 8” round and for square wafers up to 156mmx156mm.


  • Dual white light chromatic coding probe technology with 10nm resolution
  • Thickness range from 50um to 1mm
  • Automated calibration
  • Hiscan option for surface roughness and link profile measurement and other surface structures

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Solar Wafers QA and QC, Cost effective, compact metrology tool for R&D labs for all type of wafers and surfaces.


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