Wafer Geometry Measurement System UltraMap-100B

Product Enquiry

Product Enquiry Form

By MICROSENSE

Supplier Info

Product Type:

Metrology & Handling


Application:

Wafer Dimensional Metrology


Product Description:

A Precise, Flexible Benchtop Wafer & Substrate Geometry Measurement System for Smaller Wafers

Make automatic, non-contact measurement of thickness, flatness and shape of wafers up to 4″ diameter with this compact system.


  • The system very repeatably measures wafer thickness, TTV, and shape in compliance with SEMI standards.
  • Measure with sub-micron resolution and repeatability.
  • Exclusive non-contact sensing technology with dual White light chromatic coding probes (10nm resolution)
  • System accepts wafer sizes from 1” to 4” diameter (25 to 100mm). Thickness range – 50um to 3mm
  • User selectable number of measurement points
  • UltraMap measurement software features 2D & 3D mapping along with data export
  • Wafer positioning and wafer measurement are fully automatic.  Wafers are manually loaded into the wafer holder.
  • The system features in machine automated calibration.
  • Economical yet full featured system for measuring smaller substrates

 

 

There are currently no downloads available.

There are currently no videos available.

Measure a Wide Range of Wafer Materials

  • Silicon
  • Silicon Carbide
  • Sapphire
  • Germanium
  • Compound Semi Wafers – GaAs, GaN, InP
  • Glass, Quartz, Ceramic


Product Enquiry Form