Metrology & Handling
The VWS-x00 is a Variable Wafer Sampler Tool. This wafer packing device is automated for backend applications.
- Variable Wafer Sampler “VWS”, manually lifts and presents every fifth wafer for easy access to remove or inspect.
- “VWS” is designed to minimize wafer scratching, breaking, or dumping.
- Carrier orientation specific so that the cassette fits in only one direction.
- All aluminium parts are black anodized for corrosion resistance.
Get in touch with S3 Alliance for more information on batch transfer systems.
- Wafer Size:4″, 5″, 6″ & 8″
- Weight: 3 – 5 Lbs. Approx.
- Dimensions: 11.5″ (W) x 10.7″ (D) x 14.3″ (H)
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