Metrology & Handling
Wafer Dimensional Metrology
Scanning Acoustic Microscope for Semiconductor and Industrial Materials.
- Measures the thickness of materials
- Measures the location and the size of flaw (Debonding, Delamination, Crack) inside materials and on the surface.
Standard type SAM equipment:
- Low noise by using the highly efficient linear-servo Motor
- Natural scanning & Improve of the S/N[signal-to-noise] Ratio
- High quality and accurate scanning Image
- Auto sliding door system
- Auto loading/unloading System
- A, C, T Scan
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- Semiconductor: Flip Chip, BGA, QFT, TBGA, FBGA, SOP, FET, MLCC, PCB
- Industrial: ITO Target, Wafer, Pipe, Plate, Bar, Complex Material, Piston test,
Flaw detection in Planting, Car Engine, Weld zone