Grinding Wheels for hard Materials

Product Enquiry

Product Enquiry Form


Supplier Info

Product Type:

Parts & Consumables



Product Description:

SiC Grinding Wheels, fine or coarse

  • Vitrified bond
  • Pores bond type / High Grinding performance is realized
  • Bond Hardness can be adjusted
  • Super high speed processing for hard to cut materials is realized

Sapphire Grinding Wheels, fine or coarse

  • high self sharpening, non-dressing
  • able to grind the wafers at very high speed feed rate
  • lower grinding ratio
  • customization possible

Contact us for more information on our consumables for grinding

See attached pdf files

There are currently no videos available.

Wafer Thinning of SiC or Sapphire for IC or LED Makers

Thinning of SiC or spphire Wafers for wafer makers


Product Enquiry Form