R&D CMP POLI 300

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By GNP

Supplier Info

Product Type:

Equipment


Application:

CMP


Product Description:

The GNP POLI-300 is designed for Advanced CMP Process Development Applications such as MEMS, as well as CMP Characteristics Study. This System has Low Cost of Ownership and Small Footprint.


  • Head, Table 30 ~ 200rpm, Rotational motion, Head oscillation(± 10㎜)
  • Size 800W 720D 1,620H㎜
  • Platen size Ø300㎜, Anodized Aluminum
  • Pressing method Variable air pressure electronic controller
  • GnP POLI-300 : 80 ~ 300g/㎠(1.1psi ~ 4.2psi) for 4” wafer
  • Process Automatic sequence, Dry -in / Wet-out

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  • Workpiece Max 4 inch wafer, MEMS structure, Coupon wafer
  • CMP Process  Si CMP, Oxide CMP (BPSG, TEOS, ThOx), Metal CMP(W, Cu), STI, etc.


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