The GNP POLI-300 is designed for Advanced CMP Process Development Applications such as MEMS, as well as CMP Characteristics Study. This System has Low Cost of Ownership and Small Footprint.
- Head, Table 30 ~ 200rpm, Rotational motion, Head oscillation(± 10㎜)
- Size 800W 720D 1,620H㎜
- Platen size Ø300㎜, Anodized Aluminum
- Pressing method Variable air pressure electronic controller
- GnP POLI-300 : 80 ~ 300g/㎠(1.1psi ~ 4.2psi) for 4” wafer
- Process Automatic sequence, Dry -in / Wet-out
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- Workpiece Max 4 inch wafer, MEMS structure, Coupon wafer
- CMP Process Si CMP, Oxide CMP (BPSG, TEOS, ThOx), Metal CMP(W, Cu), STI, etc.