Onyx R&D PVD System

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Product Description:

Compact system with Individual modules for all necessary functions of DeGas, Preclean, sputter deposition and a high vacuum robotic transfer chamber.

Single wafer sputtering system.
Smallest Foot print in industry
Fully Automated Cassette to Cassette

Designed to meet High performance R&D and Low volume Production

Plug and Play System Design with minimal setup time.

Software with Remote diagnostics, SECS/GEM compliance

Reliable system with high uptime, >92%

    Special Process kits for:

  • Lift Off process
  • Ionized PVD for TSV

Wafer Sizes (mm): up to 200mm.
Footprint: 1657mm x 755mm x 1822mm
Substrates: Silicon, Gas, Glass, Organic, metal

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D-source magnetron technology with proven process flows gives the flexibility to deposit a variety of films:

  • Single layer, Multi-layer metals, oxides and semiconductors
  • Co-sputtered alloys of metals, oxides
  • RF or Pulsed DC or DC sputtering

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