OnTrak DSS200 Series 2 Post CMP Scrubber

Product Enquiry

Product Enquiry Form

By AXUS

Supplier Info

Product Type:

Equipment


Application:

CMP, Wet Process


Product Description:

AXUS technology is specializing in remanufacturing of CMP, Wafer Grinding & Wafer Cleaning  Equipments as well as the supply of upgrades and spareparts. OnTrak DSS-200 Series 2 Post CMP Cleaner. OnTrak DSS 200 Series 2 Double-sided PVA Scrubber offers production-proven cleaning results for particles as small as 0.125µm. Depending on the application, throughputs of 45-65 wafers per hour are attainable, making the DSS-200 Series 2 the most cost-effective wafer cleaning system for wafers from 150mm to 200mm.


Standard Features Include:
  • DSS200 Series2 web
  • 200mm ergonomic load station
  • Double sided PVA scrub
  • Dual brush boxes
  • Ammonia dispense
  • IR assisted spin dry station
  • Robotic unload
  • Vertical unload station
  • Touchscreen controls
Optional Features:
  • Megasonics at spin dry station
  • Multiple chemical delivery system
  • Signal light tower

The DSS-200 Series 2 is a proven, cost-effective cleaning system for the following applications.
  • Post-Chemical-Mechanical Polishing (CMP) Cleaning: Oxide, Polysilicon, Nitride, Tungsten, Aluminum and Copper
  • General purpose cleaning: post-CVD oxides, post-metallization, surface topography cleaning, trench cleaning
  • Silicon cleaning: prime silicon; reclaim silicon, fab monitor reclaim


Product Enquiry Form