The Okamoto VG-201 machine materializes high-efficiency operation by grinding Si, GaAs, and other semiconductor surfaces, transporting them, and loading/unloading them simultaneously.
Axus technology is specializing in remanufacturing of CMP, Wafer Grinding & Wafer Cleaning Equipments as well as the supply of upgrades and spareparts.
Axus Technology maintains an inventory of high quality new, used and refurbished process equipment. Standard specifications for these systems are provided below. We also specialize in providing engineering modifications and enhancements to these systems. This capability enables us to configure these systems for unique or non-standard applications, which may result in changes or improvements to these specifications. Please contact us to discuss your specific requirements.