Okamoto GNX 200 Grinder

Product Enquiry

Product Enquiry Form

By AXUS

Supplier Info

Product Type:

Equipment


Application:

Grinding


Product Description:

AXUS technology is specializing in remanufacturing of CMP, Wafer Grinding & Wafer Cleaning Equipment as well as the supply of upgrades and spareparts. The Okamoto GNX 200 System is a fully automatic wafer grinder with down-feed grinding method and Robotics wafer handling. The machine can grind semiconductor material such as Si, GaAs and GaP, and can grind electronic material such as ferrite and ceramic. Utilizing the Okamoto grinding method, the machine can achieve high wafer throughput without influencing machining accuracy.


Features Include:
  •     Precision, high throughput grinding system
  •     Two step grinding process with low TTV Output
  •     Multiple chuck system maximizes throughput with minimal handling

There are currently no downloads available.

There are currently no videos available.

Theres currently no information available for application.


Product Enquiry Form