SiC Mechanical MC-Х slurry

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By SINMAT

Supplier Info

Product Type:

Parts & Consumables


Application:

CMP Consumables


Product Description:

These slurries are based on nanodiamond particles and are designed to achieve high removal rates with high finish and low sub-surface damage on single crystal wafers.

Unique Aspects of Silicon Carbide ( SiC) Polishing Technology

  • Ultra-high Polishing rates (up to 10 times faster than existing processes)
  • Achieve atomically smooth surfaces with no damage
  • Polish all surface types (lapped or mechanically polished) into epiready finish
  • Both Si-face, C-face and single or polycrystalline surfaces


High removal rates up to > 10 microns/hr.

 

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These slurries are based on nanodiamond particles and are designed to achieve high removal rates (> 10 microns/hr.) with high finish and low sub-surface damage on single crystal wafers


Product Enquiry Form