By SINMAT
Supplier Info
Product Type:
Parts & Consumables
Application:
CMP Consumables
Product Description:
These slurries are based on nanodiamond particles and are designed to achieve high removal rates with high finish and low sub-surface damage on single crystal wafers.
Unique Aspects of Silicon Carbide ( SiC) Polishing Technology
- Ultra-high Polishing rates (up to 10 times faster than existing processes)
- Achieve atomically smooth surfaces with no damage
- Polish all surface types (lapped or mechanically polished) into epiready finish
- Both Si-face, C-face and single or polycrystalline surfaces
High removal rates up to > 10 microns/hr.
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These slurries are based on nanodiamond particles and are designed to achieve high removal rates (> 10 microns/hr.) with high finish and low sub-surface damage on single crystal wafers
