Laminator

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By TEIKOKU

Supplier Info

Product Type:

Equipment


Application:

Taping Detaping Mounting Curing


Product Description:

Fully-automatic tape laminators and vacuum laminators


VXL-1200X> 300mm Fully-automatic Vacuum Laminator

 

  • A vacuum laminator for wafers of 300mm.(optionally available: 8inches)
  • Single and double cassette loading
  • Two cutting methods (including V-notch cutting): digital cutter blade method, Pre-Cur method
  • All parameters important for taping can be controlled in the recipe. Equipment can be configured with ultimate vacuum at 100Pa.
  • can be used with thinner wafers (such as shaped or reworked wafers)
  • other optional features are available.
  • Power AC200 – 240V, Single Phase Power
  • Consumption 3KVA
  • Clean Air Pressure (CDA) 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min )
  • Vacuum 650 – 750mmHg ( Min Flow Rate:60NL/min )
  • Exhaust Duct Capacity 5.0m3/min, 40mmH20 (100mm diameter SUS Flange duct connection)
  • System Arrangement Clean Air Pressure (CDA) 0.5 – 0.6 MPa (Min Flow Rate: 120NL/min)
  • Vacuum 650 – 750mmHg (Min Flow Rate:60NL/min )
  • Exhaust Duct Capacity 5.0m3/min, 40mm H20 (100mm diameter SUS Flange duct connection)

EXL2-1200X> 300mm Fully-Automatic Wafer Tape Laminator

 

  • A tape laminator for wafers up to 300mm (optionally available: 8inches)
  • Single and double cassette loading
  • Two cutting methods (V-notch cutting): digital cutter blade method and class 4 CO2 laser method.
  • All parameters important for taping can be controlled in the recipe.
  • can be used with thinner wafers.(such as shaped or reworked wafers)
  • other optional features are available.
  • Power AC200 – 240V
  • Single Phase Power Consumption 3KVA
  • Clean Air Pressure (CDA) 0.5 – 0.6 MPa ( Min Flow Rate:120NL/min )
  • Vacuum 650 – 750mmHg( Min Flow Rate:60NL/min )
  • Exhaust Duct Capacity 5.0m3/min, 40mmH20 (100mm diameter SUS Flange duct connection)
  • System Arrangement Dimension (WxDxHmm) 1350 x 1750 x 2100 Net Weight Appx 1200Kg

 

DXL2-800X> 200mm fully-automatic Wafer Taper Laminator

 

  • 0 tape laminator for wafers up to 200mm (8inches) (4-, 5-, 6-, and 8-inch)
  • Two cutting methods (V-notch cutting): digital cutter blade method and class 4 CO2 laser method
  • All parameters important for taping can be controlled in the recipe.
  • can be used with thinner wafers. (such as shaped or reworked wafers)
  • other optional features are available.
  • Power AC200 – 240V
  • Single Phase Power Consumption 3KVA
  • Clean Air Pressure(CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min )
  • Vacuum 650 – 750mmHg( Min Flow Rate:60NL/min )
  • Exhaust Duct Capacity 5.0m3/min, 40mmH20( 100mm diameter SUS Flange duct connection )
  • System Arrangement Dimension: (WxDxHmm) 1250 x 1390 x 1850 Net Weight Appx 500Kg

The semi-automatic model is also available.

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