AXUS technology is specializing in remanufacturing of CMP, Wafer Grinding & Wafer Cleaning Equipments as well as the supply of upgrades and spareparts.The IPEC 776 is the most widely installed dry-in, dry-out orbital CMP platform available. The 776 includes a fully automated wafer handling system with a Spray Station Assembly used to remove slurry particulates and keep the wafers wet throughout the process.
our wafer planarizers
- Integrated double side PVA cleaner
- Three cassette tlter load/unload station
- Buff station
- Advanced pad motion control
- High speed polish drive (0-600 RPM)
- Closed loop delta P control
- Endpoint detection system
- Robot R1/R2/R3 equipped
- Stainless steel polish bell
- Pad conditioners (2)
- Upgraded 500MHz Pentium
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Production-proven for oxide, shallow trench isolation (STI), polysilicon, tungsten, and copper planarization applications