By TEIKOKUSupplier Info
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Taping Detaping Mounting Curing
- UV irradiation equipment for dicing tape. For wafers up to 300mm.
- All parameters important for UV irradiation an be controlled in the recipe.
- Settings can be quickly changed to process different wafer/frame sizes.
- Longer-lasting UV lamp realized by US’s proprietary UV technology.
- other optional features are available.
- Power AC200 – 240V
- Single Phase Power Consumption 3KVA [With UV]
- Clean Air Pressure(CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min )
- Vacuum 650 – 750mmHg( Min Flow Rate:60NL/min )
- Nitrogen(For UV) 0.2-0.4 Mpa ( Min Flow Rate:20NL/min )
- Exhaust Duct Capacity 1.0m3/min, lOmmH20 (100mm diameter SUS Flange duct connection)
- System Arrangement Dimension (WxDxHmm) 1350 x 1250 x 1800
- Net Weight Appx 500Kg
The semi-automatic model is also available. (Please contact us for details.)
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