Fully Automatic UV Irradiation Equipment

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Product Type:



Taping Detaping Mounting Curing

Product Description:


  • UV irradiation equipment for dicing tape. For wafers up to 300mm.
  • All parameters important for UV irradiation an be controlled in the recipe.
  • Settings can be quickly changed to process different wafer/frame sizes.
  • Longer-lasting UV lamp realized by US’s proprietary UV technology.
  • other optional features are available.

  • Power AC200 – 240V
  • Single Phase Power Consumption 3KVA [With UV]
  • Clean Air Pressure(CDA) 0.5 – 0.6 MPa( Min Flow Rate:120NL/min )
  • Vacuum 650 – 750mmHg( Min Flow Rate:60NL/min )
  • Nitrogen(For UV) 0.2-0.4 Mpa ( Min Flow Rate:20NL/min )
  • Exhaust Duct Capacity 1.0m3/min, lOmmH20 (100mm diameter SUS Flange duct connection)
  • System Arrangement Dimension (WxDxHmm) 1350 x 1250 x 1800
  • Net Weight Appx 500Kg

The semi-automatic model is also available. (Please contact us for details.)

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