FS-6300D Multi Wire Saw

Product Enquiry

Product Enquiry Form

By GNP

Supplier Info

Product Type:

Equipment


Application:


Product Description:

  • FS-6300D MWS for Sapphire, SiC, GaN and Hard Materials
  • Multi-Wire Saw Equipment with diamond wire application.
  • Sapphire, SiC, GaN and other hard ceramic ingots can be sawed into thin substrate.
  • Highly rigid structure based on cast iron base, spindle housing, column structure for high speed and precision cutting process.


  • Lift up ingot swing mechanism enables all point arc contact resulting in ease of recipe design and reduced wire consumption.
  • Precision tension control with servo motor and Loadcell
  • High power driving motor (30kW main + 15kw x 2 reel motor)
  • Constant wire tension & stable feed control (no up/down control)
  • Excellent precision with high stiffness main roller
  • Precision alignment of ingot mount
  • High Production capacity : 1,000wafers/day(4”)
  • Excellent wafer quality (BOW – Low production cost, Highest yield, Easy maintenance

http://gnptech2.cafe24.com/wp/wp-content/uploads/2014/04/B5a-Equipment-Specification.gif

There are currently no downloads available.

There are currently no videos available.

Cutting of Sapphire, SiC, GaN and other hard ceramic ingots into wafers-


Product Enquiry Form