FS-6300D Multi Wire Saw

Product Enquiry

Product Enquiry Form


Supplier Info

Product Type:



Product Description:

  • FS-6300D MWS for Sapphire, SiC, GaN and Hard Materials
  • Multi-Wire Saw Equipment with diamond wire application.
  • Sapphire, SiC, GaN and other hard ceramic ingots can be sawed into thin substrate.
  • Highly rigid structure based on cast iron base, spindle housing, column structure for high speed and precision cutting process.

  • Lift up ingot swing mechanism enables all point arc contact resulting in ease of recipe design and reduced wire consumption.
  • Precision tension control with servo motor and Loadcell
  • High power driving motor (30kW main + 15kw x 2 reel motor)
  • Constant wire tension & stable feed control (no up/down control)
  • Excellent precision with high stiffness main roller
  • Precision alignment of ingot mount
  • High Production capacity : 1,000wafers/day(4”)
  • Excellent wafer quality (BOW – Low production cost, Highest yield, Easy maintenance


There are currently no downloads available.

There are currently no videos available.

Cutting of Sapphire, SiC, GaN and other hard ceramic ingots into wafers-

Product Enquiry Form