- FS-6300D MWS for Sapphire, SiC, GaN and Hard Materials
- Multi-Wire Saw Equipment with diamond wire application.
- Sapphire, SiC, GaN and other hard ceramic ingots can be sawed into thin substrate.
- Highly rigid structure based on cast iron base, spindle housing, column structure for high speed and precision cutting process.
- Lift up ingot swing mechanism enables all point arc contact resulting in ease of recipe design and reduced wire consumption.
- Precision tension control with servo motor and Loadcell
- High power driving motor (30kW main + 15kw x 2 reel motor)
- Constant wire tension & stable feed control (no up/down control)
- Excellent precision with high stiffness main roller
- Precision alignment of ingot mount
- High Production capacity : 1,000wafers/day(4”)
- Excellent wafer quality (BOW – Low production cost, Highest yield, Easy maintenance
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Cutting of Sapphire, SiC, GaN and other hard ceramic ingots into wafers-