DISCO DFG 860 Grinder

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This grinder for 300mm wafers has two-spindle, three-rotary-chuck table specifications. It is a high-rigidity, high-precision grinder that can handle heavy grinding and thin grinding of 300mm wafers. The compact DFG860 is easy to maintain.
Axus Technology maintains an inventory of high quality new, used and refurbished process equipment. Standard specifications for these systems are provided below. We also specialize in providing engineering modifications and enhancements to these systems. This capability enables us to configure these systems for unique or non-standard applications, which may result in changes or improvements to these specifications. Please contact us to discuss your specific requirements.

  •     2-Spindle
  •     3-Rotary chuck
  •     High-rigidity, high-precision grinder
  •     Can handle heavy and thin grinding of 12″ wafers.

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